Apple iPhone 18 Pro A20 Pro Processor Leaked with WMCM Packaging, Upgraded NPU on Friday

According to tech media reporting on Friday (June 26), Apple's next-generation iPhone 18 Pro motherboard schematics were leaked by tipster Reptalica, revealing that the A20 Pro processor will adopt TSMC's 2-nanometer process and introduce Wafer-Level Multi-Chip Module (WMCM) packaging technology for the first time, alongside an expanded Neural Engine (NPU).

The WMCM packaging relocates DRAM from the top of the SoC to the chip's side, improving thermal conductivity and reducing thermal throttling during high-load operations. Apple maintains the same packaging footprint as the A19 Pro while further expanding the NPU's area to enhance on-device AI performance for Siri and other features.