TSMC's CoPoS Advanced Packaging to Enter Mass Production in H2 2028

According to analyst Ming-Chi Kuo, TSMC's next-generation CoPoS advanced packaging is expected to enter mass production in the second half of 2028. Glass materials will not replace ABF film; instead, chip interconnection will be achieved through redistribution layers on the chip side, glass through-holes and copper interconnect structures within the glass substrate, and ABF lamination layers. Glass and ABF film will coexist in a complementary structure with no substitution relationship.
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