TSMC Partners with Ibiden and Innolux to Develop Glass Substrate for AI Chips, Targeting 2028 Production

According to analyst Ming-Chi Kuo, TSMC unveiled advanced glass substrate technology for AI chip packaging at Japan's JPCA Show on June 11. The company is collaborating with Ibiden and Innolux to develop a glass core layer integrated within its CoPoS packaging architecture, which improves power integrity and enables higher computational performance. The technology uses a three-layer structure with glass sandwiched between two layers of ABF substrate. Test samples measure 250×250 millimeters and feature 24–28 layers, representing the mainstream specifications for 2027–2028 AI chips. TSMC aims to commence mass production by Q4 2028 or Q1 2029.
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