Shenzhen Hongxinyu Electronics Submits Hong Kong IPO Application on July 3

According to Hong Kong Stock Exchange filings, Shenzhen Hongxinyu Electronics submitted an IPO application to the Hong Kong bourse on July 3, with China CITIC Securities International as exclusive sponsor. The company plans to allocate proceeds toward product development, main controller chip iteration, and capacity expansion. Founded in 2018, Hongxinyu is China's second-largest independent memory manufacturer and ranks fifth globally, offering embedded storage (eMMC/UFS), solid-state drives (SSD), mobile storage, and DRAM modules for consumer electronics, automotive, and data center applications. It has supplied products to Xiaomi, OPPO, vivo, and TCL, and holds automotive-grade certification.
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