Liding Semiconductor Submits IPO Application to Hong Kong Stock Exchange on July 2

According to Hong Kong Exchanges and Clearing on July 2, Liding Semiconductor Technology (Shenzhen) Co., Ltd. submitted an application to list on the Main Board of HKEX, with CITIC Securities as sole sponsor. The company is an IC substrate supplier specializing in FCBGA, FCCSP, and WBCSP substrates. By 2025 revenue, Liding ranked third among IC substrate manufacturers in mainland China, up from sixth place in 2023, according to Frost & Sullivan.
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