Samsung Electro-Mechanics Rises 3.63% on June 30 Ahead of Trillion-Won AI Server Packaging Expansion

According to The Chosun Daily, Samsung Electro-Mechanics rose 3.63% in early trading on June 30 after reports indicated the company would announce a trillion-won expansion investment for its Sejong plant on July 2. The plan includes establishing a package-substrate production line for AI servers. Package substrates are high-density circuit boards that connect and protect chips; flip-chip ball grid array (FC-BGA) substrates are used in server CPUs and AI accelerators. Currently, Samsung produces FC-BGA substrates in Busan and Vietnam, so the Sejong expansion would enhance its more advanced, server-focused packaging capacity.
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