Intel Considers Dual-Sided Power Delivery for 1.4nm 14A Process, Risk Production in 2028

According to BlockBeats, on July 5, Intel is considering adopting a dual-sided power delivery architecture for its 1.4nm-class 14A process node to compete with TSMC and Samsung. The company originally planned to use the PowerDirect backside power delivery technology in 14A but is now evaluating a Dual-side approach that leverages both front and back metal layers. Intel's 14A process targets an M0 pitch of 28 nanometers with 1.3x higher chip density than 18A; the follow-up 14A2 process may achieve a 21nm M0 pitch through half-node improvements. Intel aims to release the 14A process design kit version 0.9 to external customers in October 2026, with 14A risk production planned for 2028 and volume production in 2029.
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