China's CXMT Tests Bonded DRAM Line Without EUV, Reportedly Ahead of Samsung and SK Hynix

According to Korean media reports, China's CXMT is testing a bonded DRAM production line in Hefei that bypasses EUV lithography by using only deep ultraviolet (DUV) exposure technology. Bonded DRAM separates memory arrays and peripheral circuits across different wafers before bonding them together, enabling ultra-high-density production without EUV equipment. Korean assessments suggest CXMT may lead Samsung Electronics and SK Hynix—which are developing similar technologies under Samsung's "B1b" project and SK Hynix's parallel efforts—in both technological capability and development speed.
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