Applied Materials Launches Two New Systems for 3D Wafer Manufacturing on Monday

Applied Materials introduced two new systems on Monday (June 15) designed to address precision manufacturing challenges in high aspect ratio 3D structures for advanced semiconductor logic and memory chips.

The Centris Spectral SiN ALD and Producer Selectra Mo Etch systems target dielectric thin-film deposition and selective metal removal processes, respectively. According to the company, both systems are already in mass production use by leading logic and memory chip manufacturers for advanced nodes. The stock rose 3.27 percent to $585.78, hitting a new record high.