TSMC's CoPoS Advanced Packaging Running on Trial Lines, Production Expected to Rise Significantly Over Next Two to Three Years

According to TSMC CEO, the company's CoPoS advanced packaging technology is running on trial production lines, with production expected to significantly increase over the next two to three years. TSMC is also expanding mature-process wafer capacity, including a new fab in Japan to meet CMOS image sensor demand and a facility in Germany to support automotive and industrial applications.
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