Tower Semiconductor Announces $3B Japan Investment, Including $1B Government Subsidy, to Expand Chip Manufacturing

According to Reuters, Tower Semiconductor announced today (July 14) a $3 billion investment to expand chip manufacturing in Japan, with $1 billion in funding from the Japanese government. The company will increase 300mm silicon photonics device capacity in two phases. The first phase involves upgrading its Fab 6 facility and is expected to commence full production in Q4 2027. The second phase, launched in parallel, will include building a new 300mm lithography fab adjacent to its Fab 7 facility.
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