Samsung Considers Outsourcing Google 2nm TPU I/O Die Backend Design

According to analyst jukan from Citrini, Samsung Electronics is currently considering outsourcing the backend design work for Google's 10th-generation 2nm TPU "Icefish" I/O Die, with inquiries already made to design solution partners. The TPU, used to run Google's AI models including Gemini, is planned for mass production as early as 2028. Google and MediaTek are jointly designing the chip, which consists of a compute processor manufactured by TSMC at 1.4nm and an I/O Die made by Samsung at 2nm. Potential outsourcing contractors mentioned include ADTechnology, Gaonchips, and Alphachips.
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