Dilong Stock's CMP Polishing Fluid Wins Supplier Award From Leading Wafer Fab, Gets SiC Batch Orders on May 25

On May 25, Dilong Stock announced that its subsidiary Dingze New Materials achieved significant progress in semiconductor CMP polishing fluid. Its core products won an excellent supplier award from a leading wafer manufacturer, while copper barrier layer polishing fluid secured new customer batch orders and silicon carbide substrate polishing fluid landed batch orders, marking the company's entry into the third-generation semiconductor market.

Dilong's polishing fluid portfolio now covers all product categories. The two main product types—alumina-based and copper process polishing fluids—are critical semiconductor manufacturing consumables, accounting for over 20% and 45% of China's polishing fluid market respectively, with the combined market expected to exceed 4 billion yuan in 2026.